| 摘要 |
PURPOSE:To make it possible to manufacture a printed-wiring board having a good sticking tendency to a wire by a method wherein an adhesion layer is activated by a laser system using an optical fiber as an optical path. CONSTITUTION:A printed-wiring board is constituted into such a structure that when an insulating wire 2 situated at a wire feed part 6 is made to pass through a wire guide 9 and is sent out from the guide 9, a laser beam passing through an optical fiber 3 is emitted on the contact between an adhesion layer 4 and the wire 2 to soften the layer 4. A force facing downward is applied to a stylus 1 via a spring 7 for pushing the wire 2 in this softened layer. In such a way, the laser beam is locally emitted on the surface of the layer 4 formed by applying an unhardened thermosetting resin on the surface of a laminated board 5 for electric circuit use, the electrically insulated wire 2 is pressed into the softened layer 4 consisting of the softened thermosetting resin and the wire 2 is provided on the surface of the board 5. Thereby, a reliable fixing and bonding of the wire can be realized and a spot position and the like can accurately be obtained. |
