发明名称 |
METHOD MAKING AN ULTRA HIGH DENSITY DRAM CELL WITH STACKED CAPACITOR |
摘要 |
An ultra high integration DRAM cell and a method of manufacturing therefor are provided which increases the capacitance of the cell capacitor. The plate electrode consists of the second and fourth polycrystalline silicon layers; the storage electrode consists of the third polycrystalline silicon layer; the dielectric layer is increased by the area of the first dielectric layer.
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申请公布号 |
US5096847(A) |
申请公布日期 |
1992.03.17 |
申请号 |
US19900489820 |
申请日期 |
1990.03.09 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, IN-SEON;CHOI, SU-HAN |
分类号 |
H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L27/10;H01L27/108 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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