发明名称 METHOD MAKING AN ULTRA HIGH DENSITY DRAM CELL WITH STACKED CAPACITOR
摘要 An ultra high integration DRAM cell and a method of manufacturing therefor are provided which increases the capacitance of the cell capacitor. The plate electrode consists of the second and fourth polycrystalline silicon layers; the storage electrode consists of the third polycrystalline silicon layer; the dielectric layer is increased by the area of the first dielectric layer.
申请公布号 US5096847(A) 申请公布日期 1992.03.17
申请号 US19900489820 申请日期 1990.03.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, IN-SEON;CHOI, SU-HAN
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L27/10;H01L27/108 主分类号 H01L27/04
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