发明名称 透光性硬質基板積層体の製造方法及び透光性硬質基板貼り合わせ装置
摘要 Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision while increasing production efficiency. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, only the fixing agent present in outer peripheral portions of both translucent rigid substrates is cured for provisional fastening.
申请公布号 JP6012601(B2) 申请公布日期 2016.10.25
申请号 JP20130524715 申请日期 2012.07.13
申请人 デンカ株式会社 发明人 栗村 啓之
分类号 B32B37/12;C03C27/10;C09J4/02 主分类号 B32B37/12
代理机构 代理人
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