发明名称 |
CONNECTION TERMINALS BETWEEN SUBSTRATES AND METHOD OF PRODUCING THE SAME |
摘要 |
PCT No. PCT/JP86/00364 Sec. 371 Date Feb. 19, 1987 Sec. 102(e) Date Feb. 19, 1987 PCT Filed Jul. 16, 1986 PCT Pub. No. WO87/00686 PCT Pub. Date Jan. 29, 1987.A stack layer structure is formed wherein solderable metal layers are provided at least at two ends thereof, and at least a metal layer for preventing the diffusion of solder is inserted between the two metal layers. In an interboard connection terminal and a method of manufacturing the same, a pair of solder bumps are fixed to be in contact with the two surfaces of the resultant stack layer structure. |
申请公布号 |
EP0229850(B1) |
申请公布日期 |
1992.06.10 |
申请号 |
EP19860904381 |
申请日期 |
1986.07.16 |
申请人 |
NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
发明人 |
OSAKI, TAKAAKI;MATSUI, NORIO;EGAWA, YUTAKA;SASAKI, SHINICHI |
分类号 |
H01L21/60;H01L23/48;H01L23/485;H01L23/538;H05K1/03;H05K1/18;H05K3/34;H05K3/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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