| 摘要 |
PURPOSE:To make it possible to align an outer layer pattern with both a via hole and a through hole and enhance the yield of a product by pasting a film with the via hole prior to the integration of laminated layers. CONSTITUTION:After a via hole 1 of IVH and a through hole 2 for an AC layer and an FB layer are bored and the through hole is plated, an inner layer circuit is formed and laminated layers are pressed. During this process, the IVH installed inside and outside a product where no circuit pattern is formed is pasted with release tape from the inner layer side. A print positioning guide 3 is installed to the outer layer which is located at a position, responding to the via hole 1. Printing is carried out monitoring the hole positions of the IVH of the guide 3 and the through hole 2. If the inside display of the guide 3 does not cover the through hole and the via hole 1 during this operation, the deviation of the pad against hole positioning will be absorbed within the specification. |
