发明名称 RESIN MOLDING DIE
摘要 PURPOSE:To prevent short (unfilled) molding and void from developing due to the charging of resin material of a pot under the condition being insufficiently melted and containing highly viscous portion, in a cavity. CONSTITUTION:An inclined part is formed at the bottom face 8 of a pot 1 so as to gradually decrease the depth of the pot 1 towards the outlet 9 of the pot so as to push the resin, which lies near the outlet 9 of the pot and is insufficiently hot-melted and consequently highly viscous, along the inclined part at the bottom face 8 of the pot to the direction going away from the outlet 9 of the pot. In return, the resin, which is enough hot-melted at the side far away from the outlet 9 of the pot and is lowly viscous, is pushed to the outlet 9 side of the pot so as to be charged in a cavity 4.
申请公布号 JPH04223119(A) 申请公布日期 1992.08.13
申请号 JP19900406499 申请日期 1990.12.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAINO NORIYUKI;ARIYOSHI HIDEHO
分类号 B29C45/02;B29C45/26;B29L31/34;H01L21/56 主分类号 B29C45/02
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