| 摘要 |
PURPOSE:To fix a mask forming a part of a magnetic circuit rigidly by the magnetic force of a magnet and to make it possible to form solder bumps accurately by attracting the mask with the magnet having a plurality of magnetic poles. CONSTITUTION:A metal mask 11 is arranged on the surface of a substrate 12 on which solder bumps 17 are formed. A magnet 10 is arranged on the surface which is different from the surface on which the solder bumps 17 are formed. Under the state wherein the mask 11 is held with the magnet 10, solder is applied on the mask 11 by vapor deposition. Thus, the solder bumps are formed. At this time, a plurality of magnetic poles are formed on the surface which attracts the metal mask 11. Namely, the N poles and the S poles are alternately aligned in the stripe pattern. Thus, a magnetic circuit wherein the magnetic lines of force outputted from the N pole enter into the metal mask 11, pass through the mask 11 and enter into the neighboring S pole is formed. Therefore, the metal mask 11 is attracted at a plurality of positions where the magnetic circuits are formed in this constitution. Thus, the metal mask 11 is rigidly held on the wafer 12. |
