发明名称 CONDUCTIVITY GIVING MOLDING METHOD OF THERMOPLASTIC RESIN
摘要 PURPOSE:To constitute the title method so that a facial part presents excellent conductivity, by a method wherein a part of an injection mold facing the facial part, which is to expose a conductive filler during molding, is held at a high- temperature state as compared with the other part. CONSTITUTION:When resin heated and fluidized by a heating cylinder is injected through a nozzle 11, the injected resin is led into a cavity 6 by passing through a sprue 2, runner 4 and gate 5 in succession, cooled, solidified and becomes a molded product thereupon, in an injection mold. Thereupon, since a core 8 is formed of a material whose thermal conductivity is comparatively high, the facial part 9 of the molded product coming into contact with a shaping surface of the core 8 is hard to be cooled suddenly at the time of cooling and solidification and therefore, it is seldom that the surface of the conductive filler is coated with the resin.
申请公布号 JPH04229220(A) 申请公布日期 1992.08.18
申请号 JP19900416687 申请日期 1990.12.27
申请人 TIGERS POLYMER CORP 发明人 SHIBAMIYA YOSHIO
分类号 B29C33/02;B29C33/38;B29C43/36;B29C43/52;B29C45/26;B29C45/73;B29K105/16 主分类号 B29C33/02
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