CIRCUIT PACKAGE BY FLUID-COOLING SYSTEM

摘要

PURPOSE: To cool heat-generating components by a simple cooling system at relatively low cost, almost without consuming space on a circuit board. CONSTITUTION: This package has the cooling system for cooling the heat- generating components 14 and 16 fitted onto the front surface 12 of a circuit board 10. A duct means 31 is fitted, so as to form a sealing plenum and send cooling liquid to the components. A hole 18 of the circuit board generates a cooling jet to be sent from the plenum to the components.