发明名称 ELECTRONIC CIRCUIT PACKAGE ASSEMBLY CAPABLE OF BEING PLUGGED IN EDGE-TYPE CONNECTOR, AND HEAT RADIATOR
摘要 PURPOSE: To improve outgoing radiation, and to simplify assembly and decomposition by providing a radiation housing, having a holding pole and a pole-bearing recessed hole in a module-type electronic circuit package. CONSTITUTION: An assembly 1 is provided with a planar substrate 2 having a rectangular shape, and members 11 and 12 constituting a radiation housing 10. The members 11 and 12 house a device 6 and a circuit part 7 mounted on the substrate 2, and they are brought into direct contact with the device 6 and the circuit part 7, and heat is radiated by a cooling fin 28. When the members 11 and 12 are assembled, the substrate 2 is fixedly set at the corresponding positions of the members 11 and 12 by an opening 15. On the other hand, the members 11 and 12 are fit by a holding pole 13 of the member 11 and a pole bearing recessed hole 14 of the member 12, and the assembly can be achieved with a prescribed allowable by the fitting of the supporting pole 13 of the member 12 and the pole-bearing recessed hole 14 of the member 11.
申请公布号 JPH04229696(A) 申请公布日期 1992.08.19
申请号 JP19910103705 申请日期 1991.03.14
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 JIYOOZEFU FUNARI;TERENSU KAARU GOODAUN;SUKOTSUTO DEEBUIDO REINORUZU;BAAGATO GAREEBU SANMAKIA
分类号 H01L25/10;H01L25/18;H01R12/18;H05K7/20 主分类号 H01L25/10
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