ALIGNER

摘要

PURPOSE:To execute a uniform exposure treatment without causing a temperature distribution at a semiconductor wafer by preventing that a gas generated from the heated semiconductor wafer is solidified and adheres to a lid body. CONSTITUTION:A lid body 23 for a chamber 10 is formed to be a two-layer structure by introduction windows 24a and 24b; a gas stream which has been heated to a temperature which is higher than that of a hot plate 9 inside the chamber 10 is generated. As another temperature-setting means, an up-and-down movement mechanism which brings the hot plate 9 close to the introducion windows is provided. The introduction windows are heated to a temperature which is higher than that inside the chamber 10. When the introduction windows are heated up to a temperature which is higher than the temperature inside the chamber 10, particles do not adhere to the introduction windows or the particles which have adhered are removed by utilizing a heat migration action.