VERFAHREN ZUR HERSTELLUNG VON LEITERPLATTEN FUER DAS ZUSAMMENSCHALTEN MIT KOAXIALKABELN UND DADURCH HERGESTELLTE LEITERPLATTEN.

摘要

The invention relates to a method for making coaxial conductor interconnection boards including, on the upper side of the board, signal conductors surrounded by a dielectric and by a conductive shield. To prevent shorting of the signal conductors with the shield, the conductors are step-stripped and the unshielded conductor end with the dielectric exposed is inserted in drilled, non-metallized holes. The completely exposed signal conductor extends to the lower side of the board and is connected conductively to terminals pads, while the shields on the upper side are connected by a conductive layer which is connected to the ground plane.