| 摘要 |
PURPOSE:To provide a sealing method in which a malfunction due to contact of a bonding wire is eliminated. CONSTITUTION:In a resin-sealing method for a semiconductor device having steps of placing a semiconductor chip 1 in a lead frame 4, die bonding and wire bonding it, the chip-1 is resin-sealed in a state that a surface of the chip 1, formed with a wire bonding pad 2 is directed down and the hanging-down part of a bonding wire 3 is held.
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