发明名称 |
Semiconductor package and manufacture thereof |
摘要 |
The present invention relates to a semiconductor package which is loaded with a plurality of high-performance integrated circuits for high-performance systems such as super computers and large-sized computers. According to the invention, the packaging density of the semiconductor is doubled by stacking upper and lower members and forming substrates loaded with a plurality of chips in a multistep structure so that the size of computers can be minimized and heat emission efficiency can be improved by forming heat sinks in a fin-pin shape.
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申请公布号 |
US5157588(A) |
申请公布日期 |
1992.10.20 |
申请号 |
US19910706898 |
申请日期 |
1991.05.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, GU S.;KIM, YOUNG S. |
分类号 |
H01L23/13;H01L23/433;H01L23/498;H01L25/065 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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