SEIKEIGATANOSHINDASHIHOHO

摘要

PURPOSE:To solve a problem of eccentricity of a wafer and a circular resin caused by abrasion, etc., of a die guide regarding a method for centering a molding die having a cavity which is equivalent to a circular region enclosing a wafer peripheral edge part of a semiconductor manufacturing device for forming a resin in the circular region. CONSTITUTION:A centering method of a molding die which uses a manufacturing device which has a registration unit 9 for registering a positioning pattern of a wafer 1 to a reference pattern, a transfer unit 4 and a molding unit 5 having a recessed region including a circular cavity in a female mold, and whose reference pattern is a positioning pattern on a centering jig which is fit to the recessed region and has a positioning pattern when the jig is reversely transferred to the registration unit 9 by the transfer unit 4 after the jig is fitted to a female mold of the molding unit 5.