| 摘要 |
PURPOSE:To facilitate a conductor wiring to the outer peripheral parts of a board, that is, a wiring to external terminals and lands for mounting use, which are provided on the board. CONSTITUTION:In a package for a semiconductor device of a structure, wherein land parts 3 arranged on a board 2 are soldered to terminals of a QFP 1 which is mounted on the board 2, the land parts 3 are arranged in a state slanted at an angle of 45 degrees to the edge sides of the board 2. |
