发明名称 TEST PAD STRUCTURE, A PAD STRUCTURE FOR INSPECTING A SEMICONDUCTOR CHIP AND A WIRING SUBSTRATE FOR A TAPE PACKAGING HAVING THE SAME
摘要 A test pad structure includes a plurality of test pads and a plurality of connection leads. The test pads are sequentially arranged from a wiring pattern on a substrate and in rows parallel with one another. The test pads include first and second groups of test pads, the first group having at least one pad and the second group having at least two pads. The connection leads extend from end portions of the wiring pattern to be connected to the test pads. The connection leads include at least one inner lead passing between the at least two pads of the second group and arranged in a first row closest to the first group. The at least one inner lead may be connected to at least one pad of the at least two pads of the second group arranged in a second row next to the first row.
申请公布号 US2016334463(A1) 申请公布日期 2016.11.17
申请号 US201615218515 申请日期 2016.07.25
申请人 Samsung Electronics Co., Ltd. 发明人 LIM So-Young;LEE Sang-Heui
分类号 G01R31/28;G09G3/00 主分类号 G01R31/28
代理机构 代理人
主权项 1. A test pad structure, comprising: a plurality of test pads sequentially arranged from a wiring pattern on a substrate and arranged in rows parallel with one another, the plurality of test pads including a first group of test pads having at least one pad arranged in a first row and a second group of test pads having at least two first pads and at least two second pads, the at least two first pads arranged in a second row parallel with the first row, and the at least two second pads arranged in a third row parallel with the first row; and a plurality of connection leads extending from end portions of the wiring pattern to be connected to the plurality of test pads, the plurality of connection leads including a first group of connection leads connected to the first group of test pads and a second group of connection leads having first leads and second leads, the first leads connected to the at least two first pads, and one of the second leads passing between the at least two first pads to be connected to at least one of the at least two second pads arranged in the third row next to the second row, wherein the at least two first pads arranged in the second row are spaced apart from each other by a space required for the one of the second leads, and wherein outer edges of the at least one pad arranged in the first row and the at least two first pads arranged in the second row are contained within outer edges of the at least two second pads arranged in the third row.
地址 Suwon-si KR