发明名称 DIP SOLDERING METHOD
摘要 PURPOSE:To offer the dip soldering method for executing soldering of a high quality, by which floating of parts mounted on a base plate and a camber of the base plate are prevented. CONSTITUTION:Floating of parts at the time of soldering and the upper camber of a base plate and the lower camber of the base plate can be prevented by providing a chuck 1 for gripping the end part of the base plate, a parts holder 6 for holding the parts of different height dimensions mounted on the base plate, a base plate camber preventive guide attached to the inside of a jet type solder tank, and a base plate receiving pin attached to the inside of a static type solder tank.
申请公布号 JPH04356354(A) 申请公布日期 1992.12.10
申请号 JP19910123649 申请日期 1991.05.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMADA TORU;SAITO KAZUE
分类号 B23K1/00;B23K1/08;B23K37/04;B23K101/42;H05K3/34 主分类号 B23K1/00
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