发明名称 Hemt structure with passivated donor layer
摘要 A channel layer, donor layer, Schottky layer, and cap layer are formed on a substrate. A source and drain are formed on the cap layer. A gate is formed on the cap layer, or at the bottom of a recess which is formed through the cap layer and partially extends into the Schottky layer. The donor and Schottky layers are formed of a semiconductive material which includes an oxidizable component such as aluminum. A passivation or stop layer of a lattice-matched, non-oxidizable material is formed underlying the source, drain, and gate, and sealingly overlying the donor layer. The stop layer may be formed between the Schottky layer and the donor layer, or constitute a superlattice in combination with the Schottky layer consisting of alternating stop and Schottky sublayers. Alternatively, the stop layer may sealingly overlie the Schottky layer, and further constitute the cap layer.
申请公布号 US5172197(A) 申请公布日期 1992.12.15
申请号 US19910812875 申请日期 1991.12.20
申请人 HUGHES AIRCRAFT COMPANY 发明人 NGUYEN, LOI D.;DELANEY, MICHAEL J.;LARSON, LAWRENCE E.;MISHRA, UMESH K.
分类号 H01L23/29;H01L29/15;H01L29/205;H01L29/778 主分类号 H01L23/29
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