发明名称 RESIN COMPOSITION FOR HEAT SEALING
摘要 <p>PURPOSE:To provide a resin composition which facilitates heat sealing and can give a constant opening strength over a wide temperature range. CONSTITUTION:The objective sealant composition consists of 65-90wt.% crystalline polypropylene resin and 35-10wt.% ethylene/propylene random copolymer having a melt index greater than that of the propylene resin. With this composition, opening is effected not by interfacial separation generally employed in heat sealing but by the cohesive failure of a sealant layer; therefore, the opening strength can be estabilished by adjusting the breaking strength of the sealant without being affected by heat sealing conditions.</p>
申请公布号 JPH0539393(A) 申请公布日期 1993.02.19
申请号 JP19910222180 申请日期 1991.08.07
申请人 SHOWA DENKO KK 发明人 KURAMOTO TETSUNOBU;NANJU TAKAO;YAMAMOTO KOUICHI
分类号 B32B7/02;B32B7/06;B32B27/32;B65D1/00;B65D1/09;C08L23/10;C08L23/12;C08L23/16 主分类号 B32B7/02
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