发明名称 |
RESIN COMPOSITION FOR HEAT SEALING |
摘要 |
<p>PURPOSE:To provide a resin composition which facilitates heat sealing and can give a constant opening strength over a wide temperature range. CONSTITUTION:The objective sealant composition consists of 65-90wt.% crystalline polypropylene resin and 35-10wt.% ethylene/propylene random copolymer having a melt index greater than that of the propylene resin. With this composition, opening is effected not by interfacial separation generally employed in heat sealing but by the cohesive failure of a sealant layer; therefore, the opening strength can be estabilished by adjusting the breaking strength of the sealant without being affected by heat sealing conditions.</p> |
申请公布号 |
JPH0539393(A) |
申请公布日期 |
1993.02.19 |
申请号 |
JP19910222180 |
申请日期 |
1991.08.07 |
申请人 |
SHOWA DENKO KK |
发明人 |
KURAMOTO TETSUNOBU;NANJU TAKAO;YAMAMOTO KOUICHI |
分类号 |
B32B7/02;B32B7/06;B32B27/32;B65D1/00;B65D1/09;C08L23/10;C08L23/12;C08L23/16 |
主分类号 |
B32B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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