| 摘要 |
PURPOSE:To obtain the title composition excellent in rigidity at high temperature, very excellent in resistance to blistering, and used for forming a housing, etc., when reflow soldering is performed on, e.g. electronic parts adaptable to the surface mounting technique (SMT). CONSTITUTION:The title composition consists of 50-94wt.% nylon 4, 6 (A) (e.g. polytetramethyleneadipamide); 5-49wt.% amorphous polyamide resin (B); 1-20wt.% olefin polymer (C) containing functional groups; and an inorganic filler (D) in an amount of 20-200 pts.wt. based on 100 pts.wt. total of components A, B and C. |
