发明名称 MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD
摘要 <p>PURPOSE:To eliminate the irregularity of position deviation between inner layer members, and improve precision, by specifying the quality and the shape of a pin used for stitching, when two sides or four sides of printed circuit boards are stitched and fixed by using a thread, in the state that the positions of printed circuits between layers of inner layer members where circuit patterns are previously formed are accurately aligned. CONSTITUTION:A resin-impregnated base member is sandwiched by two printed boards on which specified inner layer patterns are formed, and the inner layer circuit patterns are positioned. Two sides or four sides of the peripheral parts of inner layer members are stitched and fixed with a thread by using a pin composed of a piano wire (JISG3502, SWR92A) wherein the pin diameter 1 is 1.0-1.5mmphi and the tip part 2 is 0.05-0.25mmR. Resin-impregnated base members are arranged on both surfaces, and further conductor foils are stuck on the outer sides, thereby constituting one unit. A mirror plate is interposed between the units, and a plurality of the units are stuck. By heating and pressing the stuck units, a multilayer printed circuit board is completed. Thereby a multilayered printed circuit board wherein position deviation between inner layer circuit boards is very little can be obtained with high productivity and yield.</p>
申请公布号 JPH0563363(A) 申请公布日期 1993.03.12
申请号 JP19910221957 申请日期 1991.09.03
申请人 SUMITOMO BAKELITE CO LTD 发明人 AZUMA KEIJI;KURIHARA MASAKI;YAMANAKA MASAO
分类号 B32B7/08;B32B37/10;H05K3/46 主分类号 B32B7/08
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