| 摘要 |
PCT No. PCT/DE88/00488 Sec. 371 Date Apr. 10, 1989 Sec. 102(e) Date Apr. 10, 1989 PCT Filed Aug. 8, 1988 PCT Pub. No. WO89/01632 PCT Pub. Date Feb. 23, 1989.In the process described, the electronic circuits (2) for the signal processing and the sensor structures to which they are coupled are manufactured side by side on the common substrate (1). The process is characterized by the following steps: manufacture of the electronic circuits on the substrate (1) by known semiconductor techniques; application to the surface of the substrate (1) of a galvanic electrode layer (7), which may or may not be structured; application on the substrate surface containing the electrode layer of an X-ray resist layer (8), the thickness of which corresponds to a characteristic height of the sensor structures to be produced; production of negatives (10, 11) of the sensor structures in this resist layer (8) by X-ray lithography: galvanic deposition of a metal (12, 13) or a metal alloy in the negatives (10, 11) of the sensor structures using the galvanic electrode layer; division of the substrate with the sensor structures applied thereto into separate functional units or chips.
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