发明名称 INJECTION MOLDING METHOD, APPARATUS AND MOLDING DIE
摘要 The present invention provides an injection molding die unit having a simple construction and an injection molding method employing the injection molding die unit and capable of molding a composite molding in a short cycle time. After molding a first molding (70), a male die (30) is moved together with the first molding (70) by a distance (Gb) in direction (L) and, at the same time, a movable female die (14B) of a composite female die (14) is moved by the same distance (Gb) in the same direction (L) by a coil spring (29) to form a space (72) between the male die 30 and the composite female die (14) consisting of the movable female die (14B) and a fixed female die (14A), and a second molding material is injected into the space (72) to form a second molding (80). <IMAGE>
申请公布号 EP0514761(A3) 申请公布日期 1993.03.17
申请号 EP19920108098 申请日期 1992.05.13
申请人 SONY CORPORATION 发明人 MACHIDA, TETSUO
分类号 B29C45/16;B29C45/26;B29C45/33;B29L31/34;B65D85/575 主分类号 B29C45/16
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