| 摘要 |
<p>PURPOSE:To shorten the assembly time for a semiconductor device and to make possible the assembly of the device in a stable state by a method wherein only the part where a mark is to be put is molded before a die attaching and a wire bonding, a marking is executed and after that, after the die bonding and the wire bonding are conducted, the remaining part of a molding is molded. CONSTITUTION:A lead frame 14, which has a die stage part 12 supported by a frame-shaped die bar 10 via pinch bars 11 and a multitude of leads 13 supported by the bar 10, is prepared, the side of outer leads 13b is molded with a resin 15 from the boundary lines between inner leads 13a and the outer leads 13b in a frame-form and a marking 16 is put on the resin part. Then, a semiconductor chip is mounted on the stage part 12 and after electrodes on the chip are wire-bonded on the leads 13a, the remaining part of a molding is molded with a resin 15' in such a way that it is filled and after the chip, the stage part 12 and the leads 13a are sealed, the bar 10 is cut, removed and the leads 13a are molded into a prescribed form.</p> |
