| 摘要 |
<p>PURPOSE:To improve adhesion of a dry film by heating a photosensitive dry film immediately before laminated on a substrate by a heating role and by heating the substrate wherein the dry film is laminated after the lamination by the same heating roll. CONSTITUTION:A dry film with a protecting film is supplied from a photosensitive dry film roll 1, heated by a heating roll 2 and sent out by the heating roll 2 and a film keeping roll 4, and the protecting film is wound by a protecting film winding roll 5 and the film is laminated on a substrate by a laminate roll 7. The laminated substrate is sent by a feed roll and heated again by the heating roll 2. According to the device, circuit defect which has supposedly caused by lowering of adhesion is reduced to about 1/10.</p> |
