摘要 |
<p>PURPOSE:To provide a manufacture of a semiconductor laser element which improves the yield in element isolation. CONSTITUTION:In the manufacture of a semiconductor laser element, which forms scribe grooves 8 and 10 in a wafer 6, where an epitaxial layer is stacked on one side of a substrate, and cleaves the wafer 6, making use of the scribed grooves 8 and 10, and isolates the elements, the scribe groove 8 for formation of the resonator face is made in time epitaxial formation face 7 of the wafer 6, and the scribe groove 10 for element isolation is made in the substrate face 9 of the wafer 6.</p> |