| 摘要 |
<p>PURPOSE:To obtain a semiconductor device which can be enhanced in reliability and lessened in manufacturing and controlling man-hours dispensing with both the formation of a TAB lead and the interposition of an elastic component by a method wherein a semiconductor chip provided with TAB leads which is housed in a recess provided to a protective component high in thermal conductivity and fixed is mounted on a multilayered board. CONSTITUTION:A semiconductor chip 1 provided with TAB leads 5 which are cut in certain lengths without being formed and a protective component 6 which is high in thermal conductivity and provided with a recess where the semiconductor chip 1 is housed are provided. Pads 2a connected to the TAB leads 5 are provided onto the upside of a multilayered board 2 mounted with the semiconductor chip 1, and bumps 2b soldered to a mother board 11 are provided to the underside of the multilayered board. Furthermore, the protective component 6 where the semiconductor chip 1 is housed and the multilayered board 2 are joined together, and then a cap 7 is provided to seal up the semiconductor chip 1 with it. Or, the semiconductor chip 1 can be sealed up with sealing resin in place of the cap 7.</p> |
