Installation for soldering flat components - with selective soldering process made simpler and more reliable, useful in the electronic industry

摘要

Installation for soldering flat components (26), e.g., printed circuit boards, incorporates a carrier device (32) for flat components and an open-top container (12) for circulating molten solder. The rim of the container (12) is shaped so that circulating solder level (24) is essentially plane and horizontal, and there is at least one beaker-like element (58) with at least one open-top cavity for reception of solder. The element (58) can be displaced between two positions corresp. respectively to its full immersion into solder (in the container) and to a contact of the solder in the element (58) with the underside of the flat component (26). Pref. the cavity in the element (58) is a blind drilled hole. It can have an oval or elliptical cross section, with the smallest dia. from 1-3mm. It can also have two cavities. The element (58) tapers towards its top, and is carried by an essentially vertical rod (70). The rod (70) and the element (58) can be a single component or they can be an assembly of two components, e.g., the rod (70) is made of copper, with a surface barrier layer, while the element (58) is made of soft iron, with at least its cavity region tinned. A mechanism (56) is foreseen for displacement of the element (58) between its two characteristic positions. USE/ADVANTAGE - Useful in the electronic industry, in situations where selective soldering of flat components is carried out. In comparison with the traditional installations for selective soldering (involving use respectively of individual nozzles and wire with soldering irons) it is both simpler and less likely to produce faulty prods.