VERFAHREN ZUM VERBINDEN EINES HALBLEITERCHIPS MIT EINEM SUBSTRAT.

摘要

The bonding of semiconductor chips to a substrate is described wherein the first step involves the bonding of a tacky, curable and partially cured chip bonding adhesive, which is releasably supported on a support film, to the surface of the chip intended to be bonded to the substrate. The second step involves the further partial heat curing of the adhesive to convert it to a non-tacky state so that the adhesive will not undesirably stick during handling and storage operations. Thereafter, the chip with its adherent adhesive can be mounted to a substrate at elevated temperature to convert the adhesive to a more tacky state. The final step involves the curing of the adhesive after it has been used to bond the chip to the substrate.