发明名称 ELECTRIC JOINING METHOD OF ELECTROSTATIC CHUCK DEVICE
摘要 <p>PURPOSE:To provide a method of electrically joining a electrostatic chuck device elongated in service life and enhanced in reliability. CONSTITUTION:An electrostatic chuck device is composed of a substrate 1 provided with a through-hole bored in a thicknesswise direction, an electrostatic chuck sheet 2 bonded onto the substrate 2 through the intermediary of an adhesive agent layer, and a feeding sheet 3 bonded to the substrate 1 penetrating through the through-hole from the recess provided to the substrate 1. An exposed part is provided to an electrode layer 23 of the electrostatic chuck sheet 2 and a conductive layer 33 of the feeding sheet 3 respectively in a contact part between the electrostatic chuck sheet 2 and the feeding sheet 3 at the recess of the substrate 1, and the exposed parts are joined together with a conductive bonding agent selected from a conductive adhesive agent, low-melting point alloy, or a metal spring 51 and a conductive adhesive agent 52.</p>
申请公布号 JPH05102289(A) 申请公布日期 1993.04.23
申请号 JP19910284123 申请日期 1991.10.04
申请人 TOMOEGAWA PAPER CO LTD;TOSHIBA CORP 发明人 MATSUNAGA TADAO;HASEGAWA ISAHIRO
分类号 H01L21/683;B23Q3/15;H01L21/68;H02N13/00 主分类号 H01L21/683
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