| 摘要 |
PURPOSE:To produce Cu2O a lot at the time of oxidation treatment and suppress haloing development by using copper foil having specified diffracted light peak strength by an X-ray diffraction method of the Miller index surface, as copper foil for internal layer electric circuits. CONSTITUTION:An internal layer circuit board having an internal layer electric circuit made of copper foil whose surface is oxidation treated, and an external layer electric circuit laminated on the oxidation-treated surface interposing an adhesive insulating layer are provided. The peak strength of diffracted light by an X-ray diffraction method of the Miller index (200) surface of the copper foil constituting the internal layer electric circuit 1 is 41% of the peak strength of the diffraction light of (111) surface or more. This makes it possible to form an oxide film 2 having a high Cu2O ratio on the crystal face of the copper foil for internal layer electric circuits by the oxidation treatment of the copper foil, and haloing development is suppressed. Accordingly, defective adhesion of the internal layer electric circuit 1 with the adhesive insulating layer can be prevented, and the reliability can be increased since it becomes difficult for an acid treating solvent etc., to remain at the interface. |
