| 摘要 |
<p>PURPOSE:To prevent a crack or the like from occurring on a package at the time of packaging by providing a gap between two semiconductor chips and filling the gap with mold resin at the time of resin molding. CONSTITUTION:Ends of tape leads 5A, 5B which have been subjected to lea- folding working in TAB are thermo-compression-bonded to both faces of an outer lead 6a of a lead frame having a center opening. The other ends of the tape leads 5A, 5B are connected to semiconductor chips 3A, 3B via bumps 4. A gap 8 is formed at this time between rear faces of the semiconductor chips 3A, 3B depending on a degree of leg folding. Therefore, at the time of resin molding, the gap 3 is filled with mold resin 7 flowing in it. Thus, moisture cannot enter the rear faces of the semiconductor chips 3A, 3B, so that occurrence of void or thermal stress at the time of packaging a substrate can be suppressed, as well as an increase in a contact area with the mold resin 7 can improve adhesion with the mold resin 7.</p> |
