发明名称 WAFER CHUCK DEVICE
摘要 <p>PURPOSE:To make a wafer chuck light in weight and to make a resolving power stable. CONSTITUTION:A wafer chuck 1 is made light in weight by cutting a useless part thereof, while a contact surface is lessened by increasing a vacuum groove 2 in a chuck surface with which the rear of a wafer comes into contact. This constitution produces the effects of reduction of a vacuum error, a reproducing operation, the saving of articles of consumption, and the improvement of a product processing capacity, etc.</p>
申请公布号 JPH05121289(A) 申请公布日期 1993.05.18
申请号 JP19910311621 申请日期 1991.10.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 KIYOUZUKA TSUTOMU
分类号 H01L21/30;H01L21/027;H01L21/68;H01L21/683 主分类号 H01L21/30
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