| 摘要 |
A cooling apparatus for a substrate (10) with heat generating circuit devices (20) mounted on a first side (11) thereof. A second side (12) of the substrate is coated with a first layer made of a releasing agent (50). A second layer (60) made of a thermally conductive material having a low melting point is provided on the first layer. A heat sink (30) is provided on the second layer, for radiating heat transmitted from the circuit device through the substrate, the first layer and the second layer. During the assembly, the apparatus is heated and compressed to reflow the second layer reducing any air pocket formed at the substrate-to-heatsink interface. <IMAGE> |
