| 摘要 |
<p>PURPOSE:To provide a semiconductor device capable of reducing coupling capacitance between a power semiconductor element and a control circuit without lowering the heat releasing properties of the power semiconductor element. CONSTITUTION:A semiconductor device is provided with a metal base 1 which can be utilized as a heat sink. A mounting board 2 is arranged on it. The mounting board 2 is made of a ceramic insulating board 21 having a wiring pattern 3 and a metallic layer 6. The metallic layer 6 is formed on the opposite side of the wiring pattern 3 to couple the insulating board 21 with the metal base 1, but is not arranged beneath the wiring pattern 35 of a control circuit unit in order to make the stray capacitance small.</p> |
