| 摘要 |
PURPOSE:To cut a work by a wire saw in order to always stably obtain a wafer reduced in undulation and having uniform thickness. CONSTITUTION:In cutting a work W by a wire saw, the displacement of a roller 2 in the axial direction thereof is detected and the supply temp. of a slurry is controlled on the basis of the detected value. There is fixed relation between the supply temp. of the slurry and the axial displacement of the roller 2 and, therefore, when the supply temp. of the slurry is controlled on the basis of the detected value obtained by detecting the axial displacement of the roller 2,the axial displacements of rollers 2, 3, 4 can be kept constant. As a result, even when many wafers are cut out at once, the pitch of a wire 5 (the cut-out thickness of the wafer) trained over the rollers 2, 3, 4 can be kept constant without receiving the effect of friction heat and many wafers having constant thickness and reduced in undulation can be stably cut out from the work W. |
