发明名称 INTEGRATED AND THERMOFORMED PACKAGE WITH PRESCRIBED FRACTURE POINT AND MANUFACTURE OF THE SAME
摘要 <p>PURPOSE: To provide a package, easy to be separated, protecting the packaged from damages and drying by forming airtightness on one hand and on the other hand keeping the predetermined breaking points. CONSTITUTION: A thermoformed package with the integrated predetermined breaking points and a process for the production thereof are described. The predetermined breaking points are formed by the discrete regions in the plastic matrix at which points the mechanical properties of the plastic have been modified by the action of a laser beam.</p>
申请公布号 JPH05193666(A) 申请公布日期 1993.08.03
申请号 JP19920107822 申请日期 1992.04.27
申请人 HOECHST AG 发明人 ETSUKEHARUTO BIIRU;TOBIASU RENTSUSHIYU;ARUFUREETO SHIYAATO
分类号 B65B69/00;B23K26/40;B23K26/402;B29C35/08;B29C37/00;B29C59/00;B29C71/04;B65D1/30;B65D65/28;B65D75/62 主分类号 B65B69/00
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