| 摘要 |
<p>PURPOSE:To control a noise caused by impedance, by shortening a conductive path when a voltage is applied to the rear of a semiconductor wafer. CONSTITUTION:An electrode plate 11 supplied from a DUT board 1 is installed on the bottom of the DUT board 1. pogo pins 15, which are electrically connected to a chuck top 4 and are connectably installed to the electrode plate 11, are provided on the side of the chuck top 4. Since a potential is applied on the chuck top 4 by contacting the pogo pins 15 with the electrode plate 11, a short, conductive path between the chuck top 4 and a power source is obtained. Thus, the potential is applied on the chuck top 4 through the short wiring and a noise caused by impedance is controlled.</p> |
