| 摘要 |
PURPOSE:To reduce the number of components and to facilitate molding by forming a through hole passed from a bottom of a recess of an insulating block downward, and extending a pair of metal layers to be formed in the recess from the hole to the rear and a partial side face of the block. CONSTITUTION:An insulating block 4 is formed of heat resistant resin, a recess 20 for mounting an LED chip 1 is provided, and a through hole 21 is passed from its bottom to a rear surface. A continuous metal layer 19 covering the rear surface and a side face 10 from a reflecting surface of the recess 20 of the block 4 and a chip mount is formed, and a metal layer 19 is similarly formed to the rear surface of the recess 20 and a partial side face 5. Then, the chip 1 is adhered to the layer 19 of the bottom of the block 4 with conductive paste 2, and connected to the layer 18 of one side by a metal fine wire 3. Further, the recess 20 and the hole 21 are sealed with light transmission resin such as epoxy resin, etc. |
