| 摘要 |
<p>PURPOSE:To decrease cross talk between signal lines on a mounting circuit board by a method wherein the end of a first power supply layer except its part adjacent to the end of an insulating layer and the end of a second power supply layer are made to overlap each other interposing the insulating layer between them. CONSTITUTION:A first polyimide layer 2a is formed on a silicon substrate 1, and a first wiring layer composed of a first signal line 3a and a first ground electrode 4a is formed. A second polyimide layer 2b is formed, and a second wiring layer composed of a second signal line 3b and a second ground electrode 4b is provided. A third polyimide layer 2c is formed thereon, and a third signal line 3c and a cover polyimide layer 2d are successively formed thereon. An electromagnetic field between the first signal line 3a and the second signal line 3b is screened by an overlap region 6 where the electrodes 4a and 4b overlap each other, so that cross talk can be sharply lessened between signal lines.</p> |
