发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 <p>PURPOSE:To accurately cut a connection bar by forming a reference hole at the center of a resin in a sealing formation precess with a resin and then cutting out the connection bar upon positioning with the reference hole so as to cope with lead's deformation due to contraction, etc., when a resin hardens. CONSTITUTION:A reference hole 21 is easily made by forming a pin on a female mold of a mold die. By engaging the reference hole 21 with a positioning pin 31 farmed on a female die 3 which cuts a connection bar such as a tie bar 13, sure positioning is obtained. At this state, a tie tar punch 4 presses from above to accurately cut out a connection bar such as the tie bar 13, so a lead 14 is separated with little damage. To mold with resin, a lead frame 1 is aligned with a mold die using an index hole 12 of the lead frame 1 as a reference. At that time, the pin for a reference hole is farmed at, almost near, the center.</p>
申请公布号 JPH05226546(A) 申请公布日期 1993.09.03
申请号 JP19920023730 申请日期 1992.02.10
申请人 ROHM CO LTD 发明人 NEGORO ATSUHITO
分类号 H01L23/28;H01L23/50 主分类号 H01L23/28
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