| 摘要 |
<p>PURPOSE:To comply with various kinds of packages by designating only a substrate by providing the following: an input/output pad for a semiconductor chip; a lead to be connected electrically tap the outside; a pad to be connected electrically to them; and electric interconnection to which both pads are connected. CONSTITUTION:A substrate 2 is fixed and bonded to an island 3; a semiconductor chip 1 is fixed and bonded to it. An input/output pad 7 for the semiconductor chip 1 is connected, by means of a wire 5, to a pad 8 which is connected to the semiconductor chip 1 on the substrate 2. The pad 8 is connected to a pad 9 which is connected to a lead 4 which is connected electrically to the outside by using an interconnection 10. The pad 9 is connected to the lead 4 by using a wire 6. Since the semiconductor chip 1 add the leads 4 are not connected directly, it is not required to design the leads 4 newly, and the leads 4 which has been designed previously can be used by designing only the substrate 2. The lead can comply with various kinds of packages.</p> |
