| 摘要 |
PURPOSE:To realize a pattern cut without relation to quantity of energy of laser beam on the occaion of cutting a pattern of a thin film substrate on whose surface a patterned insulating layer is formed. CONSTITUTION:In a pattern cut constitution of a thin film substrate having a multilayer insulating layer 2 on the surface thereof and a pattern 10 formed on the surface of the insulating layer 2 cut as required with a laser beam, a dummy pattern 4 ensuring higher reflectivity of laser beam or high absorption coefficient is formed, corresponding to the forming position of the pattern 10, at a lower layer L2 of the layer L3 forming the pattern 10. |
