METHOD AND APPARATUS FOR CONNECTING FINE PITCH LEADED ELECTRONIC COMPONENTS TO PRINTED CIRCUIT BOARDS

摘要

A method is provided for forming a high density circuit board for connection of a leaded component (28) wherein at least two adjacent beam leads of the component have a pitch smaller than 0.010". The method comprises the steps of: forming connection pads (26) on the circuit board in nominal alignment with the said at least two adjacent beam leads of the component, and forming a guiding structure (30) as a peaked structure between the connection pads (26) for guiding the said at least two adjacent beam leads into alignment with the connection pads (26) during attachment of the leaded component (28) to the circuit board in accordance with the further steps of: coating a photosensitive curable polyimide material in uncured state onto the circuit board, patterning the coated polyimide material by selective exposure to light energy, removing unexposed portions of the polyimide material by an etching step to form the guiding structure means, and curing the polyimide material forming the guiding structure.