发明名称 |
ELECTROSTATIC ATTRACTING DEVICE AND PLASMA TREATMENT DEVICE |
摘要 |
<p>PURPOSE:To provide an electrostatic attracting device which can obtain a uniform attracting force over the entire surface of a wafer and can generate a uniform temperature distribution over the entire surface of the wafer. CONSTITUTION:A positive and a negative electrode 2 and 4 are constituted so that the electrodes 2 and 4 can be adjacent to each other and spirally spread in the peripheral direction of an electric field forming electrode 14 from the central part of the electrode 14.</p> |
申请公布号 |
JPH05275520(A) |
申请公布日期 |
1993.10.22 |
申请号 |
JP19920068842 |
申请日期 |
1992.03.26 |
申请人 |
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发明人 |
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分类号 |
B23Q3/15;H01L21/302;H01L21/3065;H01L21/68;H01L21/683;H02N13/00;(IPC1-7):H01L21/68 |
主分类号 |
B23Q3/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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