发明名称 ELECTROSTATIC ATTRACTING DEVICE AND PLASMA TREATMENT DEVICE
摘要 <p>PURPOSE:To provide an electrostatic attracting device which can obtain a uniform attracting force over the entire surface of a wafer and can generate a uniform temperature distribution over the entire surface of the wafer. CONSTITUTION:A positive and a negative electrode 2 and 4 are constituted so that the electrodes 2 and 4 can be adjacent to each other and spirally spread in the peripheral direction of an electric field forming electrode 14 from the central part of the electrode 14.</p>
申请公布号 JPH05275520(A) 申请公布日期 1993.10.22
申请号 JP19920068842 申请日期 1992.03.26
申请人 发明人
分类号 B23Q3/15;H01L21/302;H01L21/3065;H01L21/68;H01L21/683;H02N13/00;(IPC1-7):H01L21/68 主分类号 B23Q3/15
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