| 摘要 |
<p>PURPOSE:To avoid the thermal damage to a chip component by a method wherein the bumps may be junctioned with wiring patterns by converging laser beams on the bumps. CONSTITUTION:A chip 1 with a plurality of bumps 2 provided thereon is mounted on a circuit substrate 3 with the bumps 2 turned facedown so that respective bumps 2 may be positioned with the lands 4 of the wiring pattern of the circuit substrate 3, and tentatively fixed. Next, the IC chip 1 is sideward irradiated with laser beams 5 almost in parallel with the circuit substrate 3 to be converged by means of a condenser lens 6, etc., for junctioning respective bumps 2 with the lands 4. Accordingly, the bumps 2 only are heated without heating the IC chip 1 at all. Through these procedures, the IC chip 1 can avoid the development of defectives, thermal damage, etc., due to the migration of electrode materials, etc.</p> |
