| 摘要 |
<p>PURPOSE:To provide a semiconductor substrate manipulating jig which can prevent any influence such as external damages on a semiconductor silicon substrate. CONSTITUTION:An attracting portion 1 of a semiconductor substrate manipulating jig is provided in the proximity to the rear surface of a semiconductor silicon substrate and the external circumference of the semiconductor silicon substrate is intentionally attracted and fixed with a stopper portion 2. Thereby, grounding to the center region can be prevented. Accordingly, influence of external damages on the surface of the other adjacent semiconductor silicon substrate can be prevented.</p> |
