| 摘要 |
<p>PURPOSE:To provide a mounting method, by which the mounting area of a substrate is reduced when a plurality of bare chip ICs are mounted together, and the deviation of sealing resin is prevented when a plurality of bare chip ICs are molded. CONSTITUTION:A dam silk 2 is provided at the peripheral part of a plurality of bare chip ICs on a substrate 4. A dam silk 2, which prevents the deviation of a sealing resin 5, is provided at the suitable position in the inside of the dam silk 2 at the outer periphery. A sealing resin 5 is applied in the inside of the dam silk 2 at the outer periphery, and the bare chip ICs are sealed.</p> |
