| 摘要 |
<p>PURPOSE:To provide a semiconductor device, wherein a semiconductor chip, such as a laser chip, is firmly fixed without a fault of short-circuit. CONSTITUTION:A recessed part 43 is provided in a position, where a bonding of an aluminium positive electrode 42 is performed, a bonding material 70 is put in this recessed part 43 and a laser chip 30 is put thereon. In this state, a heating is performed to fuse the material 70 and the material 70 is hardened. At this time, as the recessed part 43 is provided, there in no possibility that the fused bonding material 70 flows out.</p> |
